Diamond Wire Wafer Slicing Machine
Main Parameter
Length（mm）:
max 600
single-row
Workpiece size（mm）:
max 156 x 156
Slice thickness（mm）:
0.10~0.20
Wire running mode
reciprocating
Wire diameter
φ0.10~φ0.145mm
Wire speed
max 1200m/min
Acceleration time
3S
Wire tension
10~40N
Wire tension control mode
servo motor control
Wire storage
Φ0.12mm 50km
Cutting roller number
2 pcs
Cutting roller center distance
370mm
coolant (cutting fluid)
water base surfactant
coolant tank capacity
320L
coolant flow
210L/min
Travel of worktable
260mm
Worktable feed speed
0.1~3mm/min
Worktable rapid traverse speed
max 250mm/min
Board of workpiece size
660mm×1
Cooling water supply pressure
0.35~0.5Mpa
Cooling water return pressure
< 0.15 Mpa
Cooling water temperature
8℃~12℃
Cooling water flow
max 20m3/h
Air pressure
0.4~0.6Mpa
Air exhaust
max 600NL/min
Power capacity
three-phasefive-wire,380V/50HZ
Machine rated current
280A
Machine rated power
122Kw
Machine weight（Kg）
about 12 tons
Dimensions (mm)
4340（L）×2470（W）×3110（H）