Wire saw QP20100

Wafer size

Max 1020mm

125x125x510mm

2

156x156x510mm

2

wafer thickness

180μm 200μm

workpiece down web

Wire guide quantity

2

Wire guide diameter

Φ350 mm

Wire guide power

61 kW servo motor

Wire motion profile

Back & forth mode

Wire diameter

Φ0.10-0.12mm

Wire tension

max 30N

Tension controlled mode

pneumatic servomechanism

Wire length

max 700km

pulley quantity

8

cutting speed

0-9mm/min

wire speed

max 15m/min

Slurry tank capacity

475L

Slurry motor power

7.5 KW

Slurry flow

160-200Kg/min

workpiece clamp mode

Auto

Air exhaust

20m3/h

Air pressure

4-6bar

1.

High processing efficient of wafer yield,only one Siliconingot every time

2.

Flexible Control System, all parameters can set and adjust acrroding user need which is convenient to adjust
production technology,to get best efficiency with lowest cost.

3.

High precision Control of Sluury temperature and flow.

4.

Employing of Siemens Industrial Computer,S7-400 series Programmable Logic Controller,Servo drive, Bus communication system to Control the machine which
makes reliable hardware.

5.

Wire tension is controlled by pneumatic servomechanism, which makes the machine run gentle and stable,with
low probability of wire broken.

6.

The stable of the machine is improved with the employ of wire broken

7.

Friendly HMI and clear icons which make operation simple.